TSMC 7 nm is expected to schedule production
- Author:Gemini
- Source:www.ramjoinwin.com
- Release Date:2015-11-16
Leading wafer foundry TSMC 10 nm process entered the stage of certification in the fourth quarter, as scheduled next season 1 begin to accept customer chip design finalized (tape - out), because the industry is generally accepted that 10 nanometers is a transitional process, which includes the program logic gate array (FPGA) giant game spirit thought (Xilinx) has decided to skip the 10 7 go directly into the nano, therefore, TSMC 7 nano research and development are speed up, hope can advance into mass production in the second half of 2018.
16 nm TSMC has entered the stage of mass production, the next generation of 10 nm process in line with expectations. With 16 nano enhanced fin type field-effect crystal control process (FinFET Plus), 10 nm TSMC process of chip density 20% increase to 2.1 times, efficiency can be improved and power consumption can be reduced by 40%, the fourth quarter of this year to complete process research and development and to begin to enter authentication stage, next season 1 can begin to accept customer chip design finalized, late 2016 or early 2017 to enter mass production, has obvious catch up with Intel's footsteps on schedule. memoria ram ddr3 8gb 1600mhz
However, TSMC client chip propulsion, 10 nanometers effectiveness rise enough to meet the actual demand, so the industry is generally believed that 10 nanometers appears like 20 nai metric cheng, belongs to the transitional process, seven nanometers will be the next generation of nodes, has a long life cycle. As game spirit thought already pointed out, the highest order the FPGA chip using 16 nm production at present, but the next generation of chips will skip 10 and directly using 7 nano mass production.
For TSMC, 10 will be 7 nano before mass production, improve the yield and through the important stage of the manufacturing process learning curve, therefore, like the relationship between 20 and 16 nano, TSMC in bamboo now 12-inch factory Fab12, CST 12 inch factory built Fab15 10 nanometers fabs, up to 9 into equipment will directly support seven nanometers, equal to the minimal investment to establish the most effective capacity.
16 nm TSMC has entered the stage of mass production, the next generation of 10 nm process in line with expectations. With 16 nano enhanced fin type field-effect crystal control process (FinFET Plus), 10 nm TSMC process of chip density 20% increase to 2.1 times, efficiency can be improved and power consumption can be reduced by 40%, the fourth quarter of this year to complete process research and development and to begin to enter authentication stage, next season 1 can begin to accept customer chip design finalized, late 2016 or early 2017 to enter mass production, has obvious catch up with Intel's footsteps on schedule. memoria ram ddr3 8gb 1600mhz
However, TSMC client chip propulsion, 10 nanometers effectiveness rise enough to meet the actual demand, so the industry is generally believed that 10 nanometers appears like 20 nai metric cheng, belongs to the transitional process, seven nanometers will be the next generation of nodes, has a long life cycle. As game spirit thought already pointed out, the highest order the FPGA chip using 16 nm production at present, but the next generation of chips will skip 10 and directly using 7 nano mass production.
For TSMC, 10 will be 7 nano before mass production, improve the yield and through the important stage of the manufacturing process learning curve, therefore, like the relationship between 20 and 16 nano, TSMC in bamboo now 12-inch factory Fab12, CST 12 inch factory built Fab15 10 nanometers fabs, up to 9 into equipment will directly support seven nanometers, equal to the minimal investment to establish the most effective capacity.